Semiconductor Plasma-resistant Coater
SPC | A Plasma-Resistant Thick-Film Evaporation Platform for Semiconductor Process Components
Semiconductor Plasma-resistant Coater｜Y₂O₃ Thick Film for Semi Equipment PartsA Plasma-Resistant Coating System Built for Semiconductor Process Components
The critical processes of semiconductor manufacturing — etching, Chemical Vapor Deposition (CVD), and plasma cleaning — all require generating high-energy, highly reactive plasma environments inside the chamber. Chamber components exposed to plasma over time (Edge Rings, Shower Heads, Cover Plates, Liners, etc.) gradually erode under plasma bombardment, releasing particles that contaminate wafers, reduce process stability, and shorten component lifetime.
To extend the service life of critical components and improve fab process stability and yield, plasma-resistant thick-film coatings using rare-earth oxides (primarily Y₂O₃, yttrium oxide) have become the industry-standard solution. The Dah Young Vacuum SPC (Semiconductor Plasma-resistant Coater) is a coating system optimized for this application — providing stable, reliable rare-earth oxide thick-film production capability for semiconductor equipment makers, component manufacturers, and in-fab maintenance service providers.
Y₂O₃ Thick-Film Capability | 10–50 Micron Continuous Deposition Without Compromise
The core of plasma-resistant coatings lies in thick-film deposition of rare-earth oxides (Y₂O₃, YF₃, etc.). Industry-standard film thickness typically falls in the 10–50 µm range, with some extreme applications requiring 100 µm or more. Conventional evaporation systems often face technical challenges depositing such thick layers — film stress accumulation, microcracking, internal porosity, and adhesion degradation.
The SPC employs a large-crucible design with optimized evaporation rate control, completing 10–50 µm continuous thick-film deposition without process interruption. Combined with the high-energy assist mode of Dah Young's in-house high-performance ion source, Y₂O₃ and other rare-earth oxide films achieve over 95% of theoretical density with porosity controlled within 1%. Such a high-density film structure maintains excellent erosion resistance even under prolonged exposure to highly corrosive plasma environments such as CF₄, SF₆, and Cl₂ — significantly extending component service life.
Fab-Grade Cleanliness Design | Meeting the Most Demanding Semiconductor Particle Standards
Semiconductor processes have an extremely low tolerance for particle contamination — any particles released from the equipment itself directly impact wafer yield. The SPC is designed from the equipment level for fab-grade cleanliness — chamber materials selected for low particle release, internal volume maintained at Class 1000 cleanliness, and all workpiece-contact components subjected to rigorous cleaning and inspection procedures.
In addition, the SPC offers an optional ISO 5 (Class 100) load/unload zone, paired with fab-grade workpiece cleaning procedures, ensuring coated components can be sent directly into the fab without secondary cleaning. For advanced processes (sub-7nm) demanding extreme particle control, the SPC delivers industry-leading contamination control.
Integrated with Dah Young Core Technologies | Stable High-Yield Thick-Film Production
Although the SPC is built for thick films, it retains the core technology assets of Dah Young's optical evaporation series: the proprietary Optical Monitoring System (OMS) tracks thick-film deposition progress in real time; the FAST coating uniformity simulator optimizes coating uniformity on complex-shaped components; and planetary rotation fixtures ensure batch-to-batch consistency in high-volume production.
The SPC offers chamber sizes including 1350, 1550, and 1800 — flexibly configured to customer component scale (from R&D prototypes to large Edge Rings and 12-inch Shower Heads). It delivers stable, reliable, fab-certification-grade thick-film production equipment for the semiconductor plasma-resistant coating market.
SpecificationSPC Series
| Item | SPC-1350 / 1550 / 1800 |
|---|---|
| Product Line | Coater Series — Semiconductor Plasma-resistant Coater |
| Substrate Material |
Quartz, Al₂O₃ ceramics, and other semiconductor process component substrates |
| Coating Technology |
E-beam Evaporation + Ion-Assisted Deposition (IAD) rare-earth oxide thick-film process |
| Primary Coating Materials | Y₂O₃ (yttrium oxide), YF₃ (yttrium fluoride), and other rare-earth oxide plasma-resistant films |
| Film Thickness | µm-scale thick-film capability (extendable per application requirements) |
| Film Density | ≧ 95% theoretical density, porosity ≦ 1% |
| Ion Source | Dah Young in-house 24 / 27 cm high-performance ion source (high-energy mode optimized) |
| Cleanliness Level |
Class 1000 internal volume design Fab-grade particle control standards |
| Ultimate Vacuum | ≦ 5 × 10⁻⁶ Torr |
| Operation Mode |
IPC fully automatic / manual mode designed for long-duration continuous deposition |
| Optional Modules | Plasma pre-treatment / high-temperature heating / multilayer film design / customized fixtures |
※ The above represents standard configuration. Actual specifications can be customized to customer application requirements.
01Rare-Earth Oxide Thick-Film Capability
- Continuous µm Deposition: Large crucibles and optimized evaporation control complete µm-scale thick films in a single process.
- High-Density Film Quality: Film density ≧ 95% theoretical density, porosity ≦ 1% — ensuring plasma-resistance performance.
- Multi-Material Support: Supports: Supports multiple rare-earth oxide plasma-resistant film systems including Y₂O₃ and YF₃.
02High-Energy IAD Process | Suppressing Stress and Microcracks
- High-Energy Ion Source: Dah Young in-house 24cm/27cm ion source provides high-energy ion-assisted strengthening of thick-film structure.
- Stress Control: Ion energy parameters balance-optimized for thick-film stress, effectively preventing film microcracks.
- High Adhesion: Withstands thermal cycling and mechanical stress in semiconductor processes — does not delaminate over long-term use.
03Fab-Grade Cleanliness Design
- Low-Particle Chamber: Chamber uses low particle-release materials, internal volume maintained at Class 1000 cleanliness.
- Optional ISO 5: Optional ISO 5 (Class 100) load/unload zone meets advanced process particle control requirements.
- Direct-to-Fab: Coated components can be sent directly into the fab without secondary cleaning.
04Dah Young Core Technology Integration | Stable High-Yield
- OMS Optical Monitoring: Integrated proprietary OMS tracks thick-film deposition progress and quality in real time.
- FAST Simulation: Combined with FAST simulation, optimizes coating uniformity on complex-shaped components.
- Planetary Fixtures: Planetary rotation fixtures ensure batch-to-batch consistency in high-volume production.
05Complete Chamber Size Range | Covering Semiconductor Component Scales
- Chamber Selection: Multiple sizes — 1350 / 1550 / 1800 — covering various component requirements.
- Large-Component Capability: The 1800 large chamber handles 12-inch Shower Heads, large Edge Rings, and other oversized components.
- Flexible Investment: Choose the optimal model based on customer business scale and component portfolio.
The SPC delivers stable, reliable plasma-resistant thick-film coating solutions for semiconductor process components — widely deployed in component protection across critical etching, CVD, and plasma cleaning equipment. It serves semiconductor equipment manufacturers, component suppliers, and in-fab maintenance service providers.
01Etcher Components
Etching is among the most demanding plasma environments in semiconductor manufacturing. Highly corrosive plasmas such as CF₄, SF₆, Cl₂, and HBr continuously bombard chamber components, requiring rare-earth oxide thick films for durable protection. The SPC delivers industry-leading plasma-resistant coating solutions for critical etcher components.
02CVD/ALD Process Components
Chemical Vapor Deposition and Atomic Layer Deposition processes involve various reactive gases and plasma environments inside the chamber. Components require plasma-resistant protection to maintain process stability, reduce particle contamination, and extend service life.
03Plasma Clean & Asher Equipment
Wafer cleaning and photoresist ashing processes use highly reactive plasmas including oxygen and fluorine plasmas. Components exposed to high-temperature plasma environments over long durations require thick-film plasma-resistant protection.
04Component Refurbishment
After semiconductor components reach end of life, they can be refurbished through old-film stripping and re-coating — substantially reducing fab component costs. The SPC provides professional thick-film re-coating capability for component refurbishment service providers.
05Display & LED Equipment
Large-format panel processes and LED epitaxy/etching equipment also use plasma processes — components likewise require plasma-resistant protection. The SPC large-chamber models handle components for large-format panel equipment.
