【What is PECVD?】

• PECVD Theory

Plasma-Enhanced Chemical Vapor Deposition (PECVD) is a widely used thin film deposition technique. Its principle involves introducing reactive gases into a vacuum chamber and applying a high-frequency electric field to generate plasma. This plasma excites the gas molecules into a state containing high-energy species such as free radicals, ions, and electrons. These active particles react on the substrate surface to form a thin film. Since the energy required for the reaction primarily comes from the plasma rather than high-temperature heating, deposition can be carried out at relatively low temperatures, making the process suitable for heat-sensitive materials.

• PECVD Features

• Low-Temperature Process: Supports low-temp deposition—ideal for heat-sensitive materials.
  
• Higher Deposition Rate: Faster than conventional CVD processes.
• Excellent Step Coverage: Ensures superior coating on sidewalls and microstructures, suitable for advanced applications.
• Tunable Film Properties: Film characteristics can be precisely controlled by adjusting parameters such as power, gas ratio, and pressure.
• Various compound coatings: Such as SiN and SiO₂ , and others.
• Wide Application Range: Suitable for various functional coatings like protective layers, dielectric films, and insulators.