【What is Sputtering?】

• Sputtering Theory

Sputtering is a Physical Vapor Deposition (PVD) technique where the basic principle involves using high-energy particles (usually argon ions) to bombard a target material. This process ejects atoms or molecules from the target, which then deposit onto a substrate to form a thin film. In the traditional sputtering process, the ejected target atoms fly towards the substrate and deposit on its surface to form the film. When reactive gases are introduced during the process, these gas molecules react chemically with the target atoms to form compound films. This process allows for the control of the film's composition and structure and is commonly used to create optical films, hard coatings, and more.

• Sputtering Features

• Innovative Activated Reactive Sputtering Technology: By decoupling sputtering from reactive gas introduction, this approach overcomes two major challenges of conventional reactive sputtering caused by target poisoning: (1) arcing on the target surface, which damages film quality; and (2) reduced effective sputtering area, which lowers the deposition rate.
• Excellent Film Adhesion & High Density: During the sputtering process, target atoms gain kinetic energy through high-energy particle bombardment, promoting tight atomic packing upon deposition. This results in dense, strongly bonded coatings with enhanced mechanical stability—ideal for high-wear and high-performance applications.
• Low-Temperature Process: Dah Young’s proprietary ICP plasma source significantly reduces process temperature, allowing thin film deposition on plastic substrates without deformation or thermal damage.
• Wide Material Compatibility: Capable of depositing various materials including metals (Al, Ti, Cu), oxides (Al₂O₃, SiO₂, TiO₂), and nitrides (AlN, TiN).
• Extensive Applications in High-End Optics: Ideal for anti-reflective coatings, optical filters, and lens coatings used in displays, precision optical instruments, and camera lenses.