ALD｜A Precision Process Flagship for Next-Generation Optical Coating

An Atomic-Level Coating System Built for Next-Generation Precision Optical Mass Production

From high-curvature AR coatings on smartphone camera modules, precision narrow bandpass filters in 3D sensing components, nanoscale optical structures in AR/VR waveguides, to high-cleanliness film layers in bio-medical optical instruments — the core characteristic of contemporary precision optical components has evolved from 'planar optics' to '3D microstructured optics'. As optical component functional surfaces grow ever more complex, conventional evaporation and sputtering technologies are gradually approaching their process limits. At this industry inflection point, Atomic Layer Deposition (ALD) technology has emerged as the core solution to next-generation optical coating challenges.

The Dah Young Vacuum ALD (Atomic Layer Deposition System) draws its technology from a technology transfer with the National Center for Instrumentation Research (NCIR), under the National Institutes of Applied Research (NIAR), Taiwan — grounded in years of ALD research achievements at a Taiwanese national research institute, combined with Dah Young Vacuum's years of optical coating mass production integration experience to build this next-generation flagship equipment. ALD employs a Plasma-Enhanced architecture, supports diverse precursors and SEMI-standard handling, with target spec covering wafer sizes from 4 inches and above. ALD is one of Dah Young's 2026 key development models, currently in Pilot phase, and we sincerely invite Taiwan's optics and semiconductor industry early adopter partners to jointly participate in specification definition and mass production validation.

ALD Core Advantages｜Three Process Capabilities Beyond the Reach of Evaporation and Sputtering

ALD's emergence as a key technology for contemporary precision optics stems from three process capabilities beyond the reach of conventional evaporation and sputtering: First, 3D Conformal Coating — through self-limiting chemical reactions, films uniformly cover complex 3D microstructures and high-curvature surfaces. Even on the inner walls of micropores with 100:1 aspect ratios, the back surfaces of high-curvature lenses, and the 3D patterns of AR waveguides, complete and uniform coating coverage is achieved. Second, sub-nanometer thickness precision — layer-by-layer atomic deposition enables 0.1 nm-class single-layer precision control, achieving the industry's highest grade of spectral precision. Third, Pinhole-free dense film quality — the atomically packed film structure eliminates pinhole defects, providing industry-leading environmental durability and long-term reliability.

These three capabilities make ALD an indispensable process for next-generation optical applications including high-curvature smartphone lens AR coatings, 3D sensing precision filters, CMOS / VCSEL semiconductor optical sensing, and AR/VR optical waveguides. For customers pursuing ultimate optical performance and mass production yield, ALD provides a core solution that conventional processes cannot deliver.

Plasma-Enhanced Architecture｜Key to Low-Temperature High-Quality Films

The core technical choice in ALD processes lies in whether plasma assistance is introduced. Conventional Thermal ALD requires high temperatures (typically 200–400°C) to complete the full chemical reaction — placing severe constraints on temperature-sensitive substrates such as plastic lenses, PC lenses, and compound semiconductors (InP / GaAs). Furthermore, thermal ALD's reaction rate is slower, and incomplete reactions may lead to elevated film absorption.

Dah Young ALD employs a Plasma-Enhanced architecture, providing high-density reactive radicals at low temperatures to achieve complete atomic layer reactions. Process temperature targets the 50–250°C range, making ALD suitable for temperature-sensitive substrates such as plastic lenses, PC lenses, and compound semiconductors. Plasma assistance also delivers superior film density, lower optical absorption, and more stable refractive index — providing industry-top film quality for precision optical applications.

NCIR Technology Transfer｜Taiwan National Research Institute Endorsement

The technology foundation of Dah Young ALD comes from a technology transfer with the National Center for Instrumentation Research (NCIR). NCIR, as a core R&D institution for Taiwan's semiconductor and optics industries, has long invested in critical research on ALD process development, equipment design, and mass production validation — accumulating rich thin-film process knowledge assets. Through formal technology transfer, Dah Young has obtained the industrialization application rights for years of research achievements, while maintaining a long-term technical collaboration relationship with NCIR.

This technology endorsement carries significant meaning for customers: (1) Technical Credibility — as a national research institute, NCIR's technology has undergone rigorous academic and industrial validation; (2) Continuous Innovation Support — Dah Young's long-term collaboration with NCIR ensures ALD technology can continuously advance with industry needs; (3) Local Industrial Chain Integration — the NCIR + Dah Young collaboration model represents Taiwan's establishment of a complete 'research → development → manufacturing' end-to-end capability in the ALD field. Customers purchasing Dah Young ALD are not merely acquiring equipment, but building a long-term strategic partnership with Taiwan's ALD industrial ecosystem.

Wafer Size Coverage from 4 Inches and Above｜NCIR Collaboration + SEMI-Standard Handling

Application scenarios for precision optics and semiconductor optics are diverse — from small-batch smartphone lens sampling in consumer electronics, to medium-volume camera module mass production, to wafer-level semiconductor optical mass production. Substrate sizes span an enormous range. Dah Young ALD's specification targets cover wafer sizes from 4 inches and above and a variety of optical components.

Handling interfaces are SEMI semiconductor industry-compatible, designed to support EFEM (Equipment Front End Module), SMIF Pod, and other diverse wafer handling solutions — integrable with customers' existing semiconductor cleanroom production lines. This design philosophy aligns with the Dah Young ORBIS Wafer-level Optical Sputter Coating System, providing customers with a complete 'ALD + ORBIS dual flagship' semiconductor optics mass production solution.

Pilot Phase｜Inviting Early Adopter Partners from the Optics and Semiconductor Industries

ALD is one of Dah Young's 2026 key development flagship models, currently in Pilot development phase. Dah Young sincerely invites Taiwan's optics and semiconductor industry early adopter partners — including smartphone camera module manufacturers, 3D sensing module manufacturers, CMOS image sensor manufacturers, MicroLED display and epitaxy manufacturers, AR/VR optical integration manufacturers, bio-medical optical instrument manufacturers, and precision optical filter manufacturers — to join the ALD Early Adopter Program.

Early adopter partners enjoy the following value: (1) Joint Specification Definition — direct participation in ALD functional definition and customization options, ensuring the final production model fully meets your process requirements; (2) Priority Sampling and Validation — priority access to Pilot machines for customer-end application validation, accelerating product development timelines; (3) Deep Local Support — Dah Young and NCIR engineering teams provide full assistance throughout process optimization, equipment tuning, and mass production transition — delivering the industry's deepest 'research institute + equipment maker + customer' tripartite collaboration model; (4) Strategic Partnership Positioning — jointly building Taiwan's domestic supply chain for ALD optical mass production, breaking free from the long-standing industry constraint of dependence on European and Japanese imported equipment.