EMI Shielding Vacuum Coater
DYSP | An EMI shielding coating solution balancing lightweight design and electromagnetic compatibility
EMI shielding needs of plastic housings | Lightweight design with EMC
Notebooks, smartphones, projectors, networking and industrial control equipment widely use plastic housings for light weight, design freedom and cost advantages. But plastic is non-conductive and cannot block electromagnetic waves the way a metal housing does. As circuit density and operating frequencies keep rising, electromagnetic interference (EMI) protection has become key to passing EMC certification and maintaining stable operation.
The Dah Young Vacuum DYSP series EMI Shielding Vacuum Coater deposits a continuous conductive metal film on the inner surfaces of plastic housings, giving lightweight plastic housings electromagnetic shielding capability. DYSP builds on the evaporation design experience of Dah Young's DYC / NCVM series and adds magnetron sputtering, overcoming the adhesion, deep-recess and curved-surface coverage limitations of conventional vacuum coating to help customers mass-produce shielded housings with a stable process.
Evaporation × sputtering in one chamber | Conductive and adhesion layers in a single cycle
The full DYSP series integrates thermal evaporation and magnetron sputtering in the same vacuum chamber, completing multilayer processes in sequence with a single pump-down:
● Thermal evaporation: High deposition rate to quickly build conductive aluminum, copper and other metal layers of sufficient thickness, improving productivity.
● Magnetron sputtering: Dense films with excellent adhesion and good coverage of housing ribs, deep recesses and curved surfaces, ideal for adhesion and protective layers.
The two deposition technologies complement each other. Customers can plan combinations of adhesion, conductive and protective layers according to product structure and shielding needs, without transferring parts between machines.
Planetary rotation fixtures | Complete coverage of housing walls and ribs
Electronic housings have complex structures, and inner walls, ribs, snap fits and bosses easily create coating shadows that interrupt the conductive film and compromise shielding. DYSP uses vertical planetary fixtures that revolve and rotate every part so that all angles face the coating sources evenly, ensuring a continuous, consistent conductive layer. The rotation system uses an inverter for soft start and soft stop to protect parts from swaying and collisions.
Selective coating × masking fixtures | Precisely preserving antenna windows and insulation zones
EMI housings often need coating only in specified areas, leaving antenna windows, connectors, snap fits and insulation zones uncoated. DYSP can be used with custom masking fixtures for selective coating, precisely controlling coating boundaries and grounding contact exposure to balance shielding performance, wireless communication and assembly needs.
Green dry process | Replacing electroless plating and conductive paint
Conventional EMI shielding often uses electroless copper/nickel plating or conductive paint spraying: electroless plating generates large volumes of heavy-metal waste liquid, while conductive paint involves solvent emissions and overspray losses. DYSP is a dry physical deposition process in vacuum with no wastewater, no exhaust and low noise pollution. Films are high in purity with controllable thickness, and inverter-driven design lowers energy use, helping customers meet green manufacturing requirements.
High-efficiency pumping × automated operation | Stable mass production
DYSP combines an oil-sealed rotary pump, Roots booster, 40,000 L/s diffusion pump and holding pump into a complete pumping system with a cryopump. A new, clean, empty chamber at room temperature reaches process vacuum within 5 minutes. A touchscreen HMI with PLC control stores multiple independent process recipes recalled with one touch, with real-time status monitoring, preventive maintenance reminders and full alarm protection to ensure stable batch quality.
Specifications
| Model | DYSP 1300 / 1600 / 1800 |
|---|---|
| Product Line | Evaporation & Sputtering Dual-Use Coater - EMI shielding coating |
| Substrates | PC, ABS, PC/ABS, PA and other engineering plastics common in electronics |
| Coating Technology |
Thermal evaporation + magnetron sputtering Dual-use across the full series RF plasma pretreatment (DYSP 1800) |
| Coating Materials |
Evaporation: aluminum (Al), chromium (Cr), tin (Sn), etc. Sputtering: aluminum (Al), chromium (Cr), copper (Cu) and other conductive materials |
| Layer Design | Adhesion, conductive and surface protective layers can be planned as required |
| Coating Method | Full-surface coating, or selective coating with custom masking fixtures |
| Pumping System | Oil-sealed rotary pump + Roots booster + diffusion pump (40,000 L/s) + holding pump + cryopump |
| Operation Mode |
Touchscreen HMI + PLC control Auto / manual Multiple process recipe storage and recall, real-time status monitoring |
| Safety Protection | Interlock protection; alarms for low compressed air pressure, low cooling water flow and pump overload; automatic emergency stop |
| Options | Chiller, chamber liner shields, custom masking fixtures, process technology and coating consumables |
Model Comparison
| Item | DYSP 1300 | DYSP 1600 | DYSP 1800 |
|---|---|---|---|
| Chamber Type | Double-door vertical, front opening |
Vertical, front opening Process chamber + load/unload chamber |
Double-door vertical, front opening |
| Chamber Size (mm) | Φ1300 × H1850 | Φ1600 × H1800 | Φ1800 × H1850 |
| Fixture Rotation | 7 / 14-axis planetary | 6-axis planetary per door | 6 / 8-axis planetary |
| Effective Coating Size | Per 7 / 14-axis configuration | Coating length 910 mm |
Φ500 / Φ430 × H1500 mm per axis (6 axes / 8 axes) |
| Thermal Evaporation |
28 filaments (adjustable as required) 30 kW (12 V × 2,500 A) |
28 heating points per door 30 kW (12 V × 2,500 A) |
1 set per door 30 kW (12 V × 2,500 A) |
| Magnetron Sputtering |
Planar target × 1 (125 × 1525 mm) DC 30 kW |
Planar target × 1 (125 × 1525 mm) DC Pulsed 20 kW |
Planar target × 2 (125 × 1525 mm) DC 20 kW × 2 |
| RF Plasma Pretreatment | — | — |
13.56 MHz, 1 kW Automatic impedance matching |
| Process Gas | Ar 1000 sccm |
Ar 1000 sccm O₂ 200 sccm |
Ar 500 sccm |
| Cryopump |
Standard 74,500 L/s |
Standard |
Standard 50,000 L/s |
| Ultimate Vacuum (Torr) | 5 × 10⁻⁶ | 8 × 10⁻⁶ | 5 × 10⁻⁶ |
|
Pump-Down Time (from atm, Torr) |
Within 5 min to 2 × 10⁻⁴ |
Within 5 min to 5 × 10⁻⁴ |
Within 5 min to 2 × 10⁻⁴ |
| Power Requirement | 3φ 380 V, 160 kVA | 3φ 380 V, 130 kVA | 3φ 380 V, 105 kVA |
| Cooling Water | 20 ~ 25°C, 200 L/min | 20 ~ 25°C, 200 L/min | 20 ~ 25°C, 120 L/min |
|
Installation Space (W × D × H, m) |
8.0 × 8.0 × 4.0 | 7.0 × 6.5 × 3.5 | 6.5 × 6.0 × 4.0 |
※ Pump-down times are measured with a new, clean, dry, empty chamber at room temperature using a cryopump; power and cooling water requirements exclude the chiller. The above is the standard configuration; actual specifications can be customized to part size, shielding requirements and capacity. Please contact our sales team.
01Evaporation × sputtering dual-use | Multilayers in a single pump-down
- High-rate conductive layer: Thermal evaporation quickly builds a conductive metal layer of sufficient thickness.
- High adhesion and coverage: Magnetron-sputtered films are dense, with good coverage of deep recesses and curved surfaces.
- No transfers: Adhesion, conductive and protective layers are completed in sequence in the same chamber.
02Planetary rotation fixtures | Continuous, consistent conductive films
- Revolution and rotation: Housing inner walls, ribs and areas around snap fits are coated evenly.
- Large batch capacity: Effective coating height up to 1500 mm for high batch output.
- Smooth rotation: Inverter-controlled soft start and soft stop.
03Selective coating | Precise control of shielded areas
- Custom masking fixtures: Masking designed from drawings to precisely define coating boundaries.
- Signal windows preserved: Antenna windows, connectors and insulation zones are unaffected by the coating.
- Grounding design: Grounding contacts exposed as required to ensure a complete conductive path.
04Green dry process
- No wastewater or exhaust: Replaces electroless plating and conductive paint spraying, with no heavy-metal waste liquid or solvent emissions.
- High-purity films: Vacuum-deposited films are high in purity with controllable thickness.
- Energy-saving design: Inverter control lowers equipment energy consumption.
05High-efficiency pumping system
- Complete pumping: Oil-sealed rotary, Roots, diffusion and holding pumps with a cryopump.
- Fast pump-down: Process vacuum within 5 minutes, shortening production cycles.
- High vacuum quality: Ultimate vacuum better than 5 × 10⁻⁶ Torr (DYSP 1300 / 1800).
06Automated operation and maintenance management
- PLC automation: Touchscreen HMI with PLC control in auto / manual modes, with interlock protection.
- Recipe management: Multiple independent process recipes stored and recalled for fast changeovers.
- Preventive maintenance: Pump operating hours are monitored to prompt preventive maintenance.
Combining evaporation and sputtering, planetary rotation fixtures and selective masked coating, DYSP provides stable, reliable EMI shielding production solutions for consumer electronics, communications, industrial and automotive electronics.
01 Notebook & Tablet
Notebooks and tablets have dense, high-frequency circuits, so plastic housings need complete electromagnetic shielding while preserving Wi-Fi and Bluetooth antenna windows. DYSP builds a conductive shielding layer on the housing interior, with masking fixtures preserving antenna areas.
02 Mobile & Consumer Electronics
Mobile devices are compact with precise part structures, so shielding films must cover precisely within limited space. DYSP's selective coating capability meets the shielding needs of phones and all kinds of consumer electronics parts.
03 Telecom & Networking
Telecom and networking equipment must balance high-frequency circuit shielding, ventilation openings and antenna placement. DYSP can plan shielded areas to the design while preserving necessary signal windows.
04 Industrial & Medical
Industrial controllers, measuring instruments and medical electronics have strict interference immunity requirements to ensure signal accuracy and stable operation. DYSP provides stable, consistent conductive films for high-reliability applications.
05 Automotive Electronics
The number of automotive electronic modules is growing rapidly, with increasingly strict EMC requirements. Plastic housings with vacuum shielding coatings combine lightweight design with EMC protection.
