Patent Certificate Number: I541612

Title: Organic Vacuum Coating System and Thin Film Formation Method

[1] Patent Claims

1. An organic vacuum coating system, comprising: a chamber (10) with a vacuum-pumpable space (11); a substrate holder (20) installed inside the space (11) of the chamber (10) for mounting a workpiece; a vapor source (30) placed in the space (11) of the chamber (10); an organic monomer supply device (40) that sprays organic monomers toward the vapor source (30) for deposition onto the workpiece; and a curing device (50) that hardens the film formed on the workpiece.
2. The organic vacuum coating system of claim 1, wherein the vapor source (30) is located at the bottom of the space (11) of the chamber (10).
3. The organic vacuum coating system of claim 2, wherein the curing device (50) is arranged around the periphery of the space (11) of the chamber (10).
4. The organic vacuum coating system of claim 1, wherein the curing device (50) is arranged around the periphery of the space (11) of the chamber (10).
5. A thin film formation method using the organic vacuum coating system of any of claims 1 to 4, wherein the space (11) of the chamber (10) is evacuated to a vacuum level between 10⁻¹ torr and 10⁻⁶ torr.
6. The thin film formation method of claim 5, wherein the temperature of the vapor source (30) is set between 200°C and 450°C.
7. The thin film formation method of claim 5, comprising a film formation step and a curing step, wherein the film formation and curing steps can be repeated.
8. A thin film formation method using the organic vacuum coating system of any of claims 1 to 4, wherein the temperature of the vapor source (30) is set between 200°C and 450°C.
9. The thin film formation method of claim 8, comprising a film formation step and a curing step, wherein the film formation and curing steps can be repeated.
10. A thin film formation method using the organic vacuum coating system of any of claims 1 to 4, comprising a film formation step and a curing step, wherein the film formation and curing steps can be repeated.

• Figure 1 is a structural schematic diagram of a preferred embodiment of the present invention.
• Figure 2 is a flowchart of one thin film formation method of the present invention.
• Figure 3 is another flowchart of a thin film formation method of the present invention.

[Figure 1]

[Figure 2]

[Figure 3]